The development of clean room is closely linked with modern industry and cutting-edge technology. Due to the environmental requirements of the precision machinery industry (such as gyroscopes, micro-bearings, etc.) and the semiconductor industry (such as large-scale integrated circuit production), the development of clean room technology has been promoted. According to domestic statistics, the pass rate of producing MOS circuit chips in an environment without cleanliness requirements is only 10% to 15%, and 64 is only 2% for storage. At present, it is quite common to use clean rooms in industries such as precision machinery, semiconductors, aerospace, and atomic energy.
The clean environment serves the production process, and the design of the clean room must meet the environmental requirements of the production process, which is a matter of course. Therefore, when designing a clean room, the production process's requirements for environmental parameters should be realistic. The area, layer height, temperature, humidity, cleanliness, etc. should be high or high, and low or low, not the higher the better. On the premise of not affecting the normal operation of the production process, the parameter requirements should be reduced as much as possible, the purification area should be controlled, the scope of the high purification level clean area should be narrowed, and the area of the 100-level and higher one-way flow clean area should be strictly controlled.
When the production process plane is divided, the clean rooms of the same level should be arranged together as much as possible, and the processes with high cleanliness requirements should be placed on the windward side, and the process equipment and containers that produce dust, toxic, harmful, flammable and explosive waste gas should be placed together. It should be placed outside the clean area as much as possible. If it must be placed in the clean area, airtight measures should be taken as much as possible to reduce the emission of dust and exhaust gas.
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